Magnesium hydroxide, with CAS No.1309-42-8, is a vital inorganic functional material widely adopted as thermal insulation and flame retardant filler in the electronics industry. When temperature rises above 340°C, it undergoes endothermic decomposition, absorbing massive heat and releasing water vapor to cool substrates and dilute combustible gases. The generated magnesium oxide forms a dense barrier, blocking heat transfer and oxygen supply to realize thermal insulation and flame resistance simultaneously.

As a halogen-free additive, it produces low smoke and non-toxic decomposition products, complying with RoHS and other electronic environmental standards. It is applied in wire insulation, electronic housing, circuit board substrates and battery components. Compared with traditional flame retardants, it features stable thermal performance during material processing. With growing demand for safe electronic products, magnesium hydroxide will maintain important value in developing high-performance flame-retardant thermal insulation composites.